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Processing Equipment×日立ハイテク - List of Manufacturers, Suppliers, Companies and Products

Processing Equipment Product List

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Atmospheric pressure plasma treatment device - Direct type

Atmospheric pressure plasma treatment device - Direct type

Has numerous achievements in leading Asian companies.

Stable plasma is generated under the counter electrode. Furthermore, by placing a dielectric between the electrodes, stable plasma can be generated and maintained. ■Processing Targets Modification/roughening of the target work surface (improvement of bonding strength, enhancement of adhesion) Removal of organic substances from the target work surface 【Features】 ■Wide compatibility: up to 2,250mm ■Excellent surface modification performance ■Physical and chemical processing is possible ■Maintenance-free ■Various reaction gases can be used: CDA (Clean Dry Air), N2, Ar, O2, etc. For more details, please download the catalog or contact us.

  • Other physicochemical equipment
  • Plasma surface treatment equipment
  • Plasma Generator

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Atmospheric Pressure Plasma Treatment Device - Arc Jet Type

Atmospheric Pressure Plasma Treatment Device - Arc Jet Type

Has numerous achievements in leading Asian companies.

We perform pinpoint processing on extremely small areas. ■ Processing Targets Surface modification/roughening of the target workpiece (improvement of bonding strength, enhancement of adhesion) Removal of organic substances from the target workpiece surface 【Features】 ■ Ideal for narrow processing areas: 10/20/35mm ■ Enables processing of three-dimensional objects in combination with robotic mechanisms ■ Compatible with various reaction gases: CDA (Clean Dry Air), N2, Ar, O2, etc. For more details, please download the catalog or contact us.

  • Other physicochemical equipment
  • Plasma surface treatment equipment
  • Plasma Generator

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Wet processing equipment

Wet processing equipment

3D structure pattern compatible! Custom equipment tailored to the unique materials and processes of MEMS.

At Hitachi High-Tech, we handle "wet processing equipment." We offer a lineup of devices compatible with thick film resist and film resist, as well as specifications for MEMS. We also customize solutions for customer-specific processes. Please feel free to consult with us. 【Features】 <Developing and Stripping Process> ■ Compatible with thick film resist and film resist ■ A wide range of options to accommodate various stripping processes ■ Unique tank structure and circulation design to prevent re-adhesion of stripped materials *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
  • others

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2019 Model Roll-to-Roll Plasma Treatment Device

2019 Model Roll-to-Roll Plasma Treatment Device

【Approximately 50% reduction in tact comparison※】For pre-treatment of adhesion of LCP, PTFE, etc., and removal of desmear and dry film. (※Compared to our conventional products)

The "Roll-to-Roll Plasma Treatment Device" has been upgraded to the 2019 model. Please refer to the main product features below. <Product Features> 1. New Electrode Adoption - Increased plasma density enhances processing efficiency per electrode. - Provides fast and highly uniform treatment (in-plane uniformity within ±15%). - Supports a maximum width of 550mm. 2. Reduced Processing Time - Plasma irradiation length reduced by approximately 50% (number of electrodes: old type 12 sheets ⇒ 2019 model 7 sheets). - Supports both sides treatment (options for both sides or one side treatment). 3. Improved Cooling Performance - Enhanced cooling to minimize substrate damage due to heat. *For more details, please download the PDF or contact us.

  • Other semiconductors

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Remote Atmospheric Pressure Plasma Treatment Device

Remote Atmospheric Pressure Plasma Treatment Device

Has numerous achievements in leading companies in Asia.

The plasma generation section and the processing section are completely separated. The processing is carried out using only radical components. ■ Processing Targets Modification of the target work surface (improvement of bonding strength, enhancement of adhesion) Removal of organic substances from the target work surface 【Features】 ■ Reduces damage to the processed film due to chemical processing using only radicals without electron or ion attacks ■ Ideal for processing conductive films and glass after electrode formation ■ Various reaction gases can be used: CDA (Clean Dry Air), N2, O2, Ar, etc. For more details, please contact us.

  • Other physicochemical equipment
  • Plasma surface treatment equipment
  • Plasma Generator

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Inline plasma treatment device

Inline plasma treatment device

High-speed, uniform, double-sided processing for pre-treatment before plating and for pre-treatment before adhering materials such as LCP and PTFE.

The "inline plasma treatment device" can be used for pre-treatment before attaching low transmission loss substrates for high-speed communication, as well as for removing residues from desmear and dry film. It also supports inline transport. <Product Features> 1. High speed and high uniformity for both sides 2. Compatible with automatic transport 3. Uniform cooling within the surface *For more details, please download the PDF or contact us.

  • Other semiconductors

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Batch-type plasma processing device

Batch-type plasma processing device

"High-speed, uniform, double-sided processing" for pre-treatment before plating and for pre-treatment before attaching low transmission loss substrates for high-speed communication.

The "batch-type plasma treatment device" can be used for pre-treatment before adhering materials such as LCP and PTFE, as well as for removing residues from desmear and dry films. It has a proven track record of over 200 units operating in mass production factories around the world. <Product Features> 1. High-speed, highly uniform double-sided treatment 2. Abundant track record 3. Uniform cooling within the surface *For more details, please download the PDF or contact us.

  • Other semiconductors

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